Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging
<p>The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market of advanced semiconductor technologies essential to AI computing.</p>
<p>The post <a href="https://www.semiconductor-digest.com/applied-materials-intel-deepen-rd-collaboration-on-transistor-scaling-and-advanced-packaging/">Applied Materials, Intel Deepen R&D Collaboration on Transistor Scaling and Advanced Packaging</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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