Samsung and SK Hynix hold back on 3D IC; CXMT and Winbond gain

AI demand is driving a sharp rise in inquiries about 3D IC, but some in South Korea say the new technology is unlikely to become a fresh growth engine for Samsung Electronics and SK Hynix. Because 3D DRAM is closer to customized memory, mass production could clash with the scale-based business model that underpins the two memory leaders.