Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing
<p>SANTA CLARA, Calif., Oct. 7, 2026 — Applied Materials, Inc. has announced it is working with Intel to accelerate development of chipmaking innovations for next-generation transistors, interconnects and advanced packaging technologies. The collaboration will bring together cutting-edge capabilities from Applied’s EPIC Center in Silicon Valley and Intel’s R&D campus in Hillsboro, Oregon to shorten time-to-market […]</p>
<p>The post <a href="https://www.hpcwire.com/off-the-wire/applied-materials-and-intel-collaborate-on-chipmaking-innovations-for-ai-driven-computing/">Applied Materials and Intel Collaborate on Chipmaking Innovations for AI-Driven Computing</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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