GlobalFoundries and TSMC Sign US Manufacturing Deal for AI Packaging

<p>Multi-year $2 billion agreement will expand capacity for advanced packaging ecosystem and support growing demand for AI and high-performance computing technologies MALTA, N.Y., Oct. 8, 2026 &#8212; GlobalFoundries (GF) today announced a manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC&#8217;s CoWoS advanced packaging ecosystem. Under the agreement, GF will [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/off-the-wire/globalfoundries-and-tsmc-sign-us-manufacturing-deal-for-ai-packaging/">GlobalFoundries and TSMC Sign US Manufacturing Deal for AI Packaging</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>