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Semiconductor Digest October 12, 2026 By Shannon Davis neutral

Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips

AI / LLMSemiconductorsManufacturingEdge AI
<p>New series of testers extend the UltraFLEXplus architecture to deliver superior floor space economics for high-mix, variable-volume manufacturing.</p> <p>The post <a href="https://www.semiconductor-digest.com/teradyne-launches-ultraflexplus-s-test-platform-for-edge-ai-chips/">Teradyne Launches UltraFLEXplus S Test Platform for Edge AI Chips</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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