Foxconn unveils Vera Rubin AI racks, liquid-cooling systems at OCP Summit
Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing platforms, high-speed interconnects, power delivery, and liquid cooling. The portfolio included Ingrasys Technology's Nvidia Vera Rubin NVL72 platform and connectivity, power, and thermal-management systems from Foxconn Interconnect Technology (FIT) as Foxconn expanded its offering from components and Compute Trays to complete AI racks.
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