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Digitimes October 14, 2026 By Jingyue Hsiao positive

Broadcom executive says chipmakers must tackle packaging, power limits together

BroadcomAI / LLMSemiconductorsData Center
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that die size, packaging, power delivery, and cooling are becoming major constraints as workloads evolve, making faster coordination essential for future system performance.
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