[PHOTO] Next-generation memory architecture
Visitors take photos of mockups of zHBM and zNAND-O, 3D architecture for advanced DRAM and NAND memory chips, at Samsung Electronics' booth for the SEDEX 2026 semiconductor exhibition at Coex in southern Seoul, Wednesday. Along with Samsung Electronics, SK hynix and 300 other companies in the semiconductor supply chain are participating in the exhibition, which runs through Friday. Yonhap
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