Open App →
Back to News Feed
Semiconductor Digest October 14, 2026 By Shannon Davis neutral

SEMI Builds a Global Home for Advanced Packaging

SemiconductorsManufacturing
<p>Advanced packaging has a bigger place at SEMICON West than ever, with three days of packaging content on this year’s program, and SEMI is building a global home for the topic through its Advanced Packaging and Heterogeneous Integration (APHI) technology coalition.</p> <p>The post <a href="https://www.semiconductor-digest.com/semi-builds-a-global-home-for-advanced-packaging/">SEMI Builds a Global Home for Advanced Packaging</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
Read original article ↗

Related Articles

ASML struggles with chip tool demand

Taipei Times · October 15, 2026

SEMI Scales Up Workforce Programs as U.S. Talent Gap Nears 200,000

When SEMI asks member companies what could hold back their growth, the number one answer is talent, Joe Stockunas, presi

Semiconductor Digest · October 14, 2026