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Digitimes October 15, 2026 By Levi Li negative

Column: 3D memory could redraw chip competition, weaken US sanctions on China

SemiconductorsMemoryManufacturingSupply ChainRegulation
In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D NAND with 128 layers or more, and restrictions on support provided by US persons.
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