India's RRP Electronics opens advanced wafer-level packaging facility in Navi Mumbai
India's RRP Electronics has inaugurated an Advanced Wafer-Level Packaging (AWLP) facility at its semiconductor unit in Navi Mumbai, Maharashtra, adding SIM and eSIM module production and specialized testing to its outsourced semiconductor assembly and test (OSAT) operations. The facility opened on October 12, 2026, according to <em>Dalal Street Investment Journal</em>.
Read original article ↗
Related Articles
46 procent af de europæiske forbrugere bekræfter, at kommunikationen med banken er blevet bedre takket være AI 29 procen
Huawei Proposes Next Generation OTN for AIDC-Centric All-Optical Network
VIENNA, Oct. 15, 2026 /PRNewswire/ -- During NetworkX 2026, Huawei shared its vision for building the "LIGHTS" All-Optic
Pig kidneys that were “frozen” for a year have been brought back to life
Pig kidneys that were cooled to -150 °C and stored in a freezer for months have been successfully rewarmed and shown to
Huawei Proposes Next Generation OTN for AIDC-Centric All-Optical Network
VIENNA, Oct. 15, 2026 /PRNewswire/ -- During NetworkX 2026, Huawei shared its vision for building the "LIGHTS" All-Optic