AI platform unifies PCB, advanced packaging workflows

<img width="800" height="440" src="https://www.edn.com/wp-content/uploads/Cadence-AuraStack.jpg?fit=800%2C440" class="webfeedsFeaturedVisual wp-post-image" alt="" style="display: block; margin-bottom: 5px; clear:both;max-width: 100%;" link_thumbnail="" decoding="async" loading="lazy" srcset="https://www.edn.com/wp-content/uploads/Cadence-AuraStack.jpg?w=800 800w, https://www.edn.com/wp-content/uploads/Cadence-AuraStack.jpg?w=300 300w, https://www.edn.com/wp-content/uploads/Cadence-AuraStack.jpg?w=768 768w" sizes="auto, (max-width: 800px) 100vw, 800px" /><p>Cadence says its AuraStack AI Super Agent is the industry's first agentic AI platform for PCB and advanced packaging design.</p> <p>The post <a href="https://www.edn.com/ai-platform-unifies-pcb-advanced-packaging-workflows/">AI platform unifies PCB, advanced packaging workflows</a> appeared first on <a href="https://www.edn.com">EDN</a>.</p>