Touch Taiwan 2027 expands tech scope with advanced packaging and SiPh shows
Touch Taiwan 2027 will take place on April 21–23, 2027, and will expand its scope with two dedicated co-located shows: the Advanced Packaging & Testing Expo and the Silicon Photonics Technology Applications Expo. Spurred by surging demand for AI, high-performance computing (HPC), and high-speed data transmission, the new additions will run alongside the established Smart Manufacturing and Smart Display exhibitions, creating a unified platform spanning semiconductor technologies, optical communications, intelligent manufacturing, and end applications.
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