VON ARDENNE Addresses Semiconductor Panel-Level Packaging Market with New HiPIMS Deposition Solution
VON ARDENNE, a global leader in high-precision vacuum coating equipment and co-developed materials solutions, today announced that it is expanding its semiconductor deposition portfolio into panel-level packaging (PLP). The HiPIMS solution deposits high-aspect-ratio barrier and seed layers in through-glass via (TGV) holes, enabling dense, highly adherent functional film deposition with improved material performance. It leverages […]
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