Von Ardenne's flexible equipment targets unsettled panel-level packaging market
German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions remains unresolved. Its tray-based systems can handle different substrate sizes without a new platform, potentially reducing equipment risk as manufacturers and customers worldwide weigh standards for advanced packaging and glass-based processes.
Read original article ↗
Related Articles
Erkenntnisse aus der Praxis werden die Evidenzbasis für die Prävention von Herz-Kreislauf-Erkrankungen erweitern MELBOUR
- Health Innovation South West y Helfie AI anuncian una colaboración para evaluar el cribado de hipertensión con un enfo
Les résultats obtenus en situation réelle viendront étayer la base de données probantes sur la prévention des maladies c
LONDON, Oct. 19, 2026 /PRNewswire/ -- Global payments infrastructure platform Mercuryo and BNB Chain, the community-driv