Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)

<p>Researchers at Argonne National Laboratory and the University of Illinois Urbana-Champaign published a technical paper titled “Agentic AI for Heterogeneous System Design Across Chip, Scale-Up, and Scale-Out Domains.” Abstract Excerpt: “The design space of modern AI/HPC systems has expanded rapidly across compute architectures, including GPUs, dataflow processors, and RISC-V accelerators; memory technologies, including HBM, GDDR,... <a class="read_more" href="https://semiengineering.com/agentic-ai-explores-heterogeneous-chip-and-interconnect-architectures-argonne-uiuc/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/agentic-ai-explores-heterogeneous-chip-and-interconnect-architectures-argonne-uiuc/">Agentic AI Explores Heterogeneous Chip and Interconnect Architectures (Argonne, UIUC)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>