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Digitimes October 20, 2026 By Jingyue Hsiao neutral

TPK targets 2028 TGV mass production with NT$6 billion investment

SemiconductorsSupply Chain
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage samples with semiconductor packaging companies. Under its stated plan, it targets core technology validation by the end of 2027 and mass production in 2028.
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