Interview: TI sees liquid cooling shift to tray-level control in AI data centers

Liquid cooling in AI data centers is moving toward more granular control architectures. Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), told <em>DIGITIMES</em> that as next-generation GPU computing power and rack power continue to rise, thermal management will shift from centralized control by a CDU to independent control for each server tray, a shift that will increase the use of sensors, drivers, MCUs, and other components within each rack.