SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

<p class="P1" data-pm-slice="1 1 []">SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a reduction of more than 30% in thermal resistance. The initiative aims to address mounting heat dissipation challenges in HBM and strengthen the company's competitiveness in AI memory.