Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)

<p>Researchers at imec published “Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration.” Summary: Researchers evaluated a 3D memory architecture that rotates DRAM dies vertically above a GPU and places cooling cavities between them as an alternative to conventional 2.5D HBM and direct-stacked HBM-on-GPU. Package-level thermal simulations examined stack height, memory capacity and organization,... <a class="read_more" href="https://semiengineering.com/vertical-dram-stacking-expands-thermal-design-space-beyond-hbm-imec/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/vertical-dram-stacking-expands-thermal-design-space-beyond-hbm-imec/">Vertical DRAM Stacking Expands Thermal Design Space Beyond HBM-on-GPU (imec)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>