Goke Microelectronics raises KGD packaging prices again
China-based IC design firm Goke Microelectronics will raise prices for its Known Good Die (KGD) packaged products by US$0.5 to US$1.5 per unit from November 2026, depending on capacity. The move marks the second price adjustment known to customers in 2026, as AI-driven memory demand keeps double data rate (DDR) memory supplies tight and pressure spreads to niche memory and integrated packaging products.
Read original article ↗
Related Articles
KLEVV UNVEILS ALL-NEW CRAS V RGB PRIME DDR5 GAMING/OC MEMORY
SUPPORTS AMD EXPO™ Technology: Featuring Ultra Low Latency WITH AWARD-WINNING FLAGSHIP DESIGN HONG KONG, Oct. 27, 2026 /
Firmable breaks into G2's global top five for momentum in Sales Intelligence
Firmable earned 17 badges in G2's Fall 2026 reports and improved its ranking in 28 of the 32 reports it featured in last
Bithumb, Mirae Asset, Daishin join growing list of cyberattack victims
Cryptocurrency exchange Bithumb, asset manager Mirae Asset Global Investments and Daishin Securities have become the lat