SK Hynix bets on EUV to extend 6F² DRAM as CXMT pushes 4F²
SK Hynix plans to extend the life of its existing 6F2 DRAM cell architecture through extreme ultraviolet (EUV) lithography and process improvements, keeping 4F2 and three-dimensional (3D) DRAM on its technology roadmap as China's ChangXin Memory Technologies (CXMT) prepares to unveil a product based on a smaller cell design.
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