From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing
<p>High-power impulse magnetron sputtering (HiPIMS) produces denser, better-adhering films than conventional sputtering, but scaling it to 200mm-plus substrates and inline production takes more than turning up the power. Authors from VON ARDENNE describe the engineering investment needed to move the technique from the lab into high-volume manufacturing.</p>
<p>The post <a href="https://www.semiconductor-digest.com/from-lab-to-fab-the-rise-of-hipims-in-semiconductor-manufacturing/">From Lab to Fab: The Rise of HiPIMS in Semiconductor Manufacturing</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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