Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography

<p>Plasma dicing offers clear advantages over saw and laser singulation for thin wafers, hybrid bonding and HBM: throughput that doesn’t depend on die count, dicing streets as narrow as 5 µm and less mechanical stress. But bumps, copper pillars and cavities make it hard to protect the die surface during plasma etching, and conventional spin coating struggles to cover that topography.</p> <p>The post <a href="https://www.semiconductor-digest.com/enabling-next-generation-plasma-dicing-with-ultrasonic-spray-coating-and-digital-lithography/">Enabling Next-Generation Plasma Dicing with Ultrasonic Spray Coating and Digital Lithography</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>