Research Insight: Kinsus Tech identifies three challenges for larger AI chip packages

Surging demand for AI computing is driving advanced packaging toward larger form factors, according to Ting-Hao Lin, R&D vice president at Kinsus Interconnect Technology, speaking at the 2026 TPCA Show. To support this trend, substrate materials must deliver low warpage and exceptional dimensional stability while overcoming challenges in thermal expansion mismatches and structural stress.