Taiflex, E Ink accelerate PTFE development for AI connectivity materials

Flexible copper-clad laminate (FCCL) maker Taiflex Scientific announced on October 28 that its board had approved a memorandum of understanding with global e-paper leader E Ink Holdings (EIH) to jointly develop AI high-speed connectivity materials. The partnership combines E Ink's expertise in base-material development and manufacturing with Taiflex's circuit-board material capabilities and industry experience to address demand for high-performance materials, mass-production capacity, and stable supply.