Extropic Signs $75 Million Letter of Intent with U.S. Department of Commerce to Scale and Onshore Thermodynamic Computing

<p>Planned CHIPS R&D funding to scale Extropic's Thermodynamic Sampling Units for AI workloads and fabricate them at an American foundry. SAN FRANCISCO and WALTHAM, Mass., July 30, 2026 /PRNewswire/ -- Extropic, the American company pioneering thermodynamic computing hardware, today...</p>