Samsung chairman highlights chip packaging, visits Japanese unit

Samsung Electronics Executive Chairman Lee Jae-yong visited the company’s semiconductor advanced packaging technology laboratory in Japan, Sunday, pledging to continue expanding its research workforce there and develop the lab into a global R&D hub for next-generation packaging technologies. According to Samsung Electronics, Lee visited Advanced Package Lab (APL) in Yokohama and discussed with researchers the latest developments in technologies for advanced packaging materials and processes, as well as ways to strengthen cooperation with Japan's materials, parts and equipment industries. Lee stressed the importance of securing advanced packaging technologies, as they are emerging as critical for artificial intelligence (AI) processor chips. APL was established in 2023 and held its official opening ceremony in September this year. Starting in 2024, Samsung Electronics has been investing 40 billion yen ($254 million) over five years to establish its research infrastructure in Japan and strengthen its competitiveness in advanced packaging technologies. APL specializes in developing and va