Laser Slicing of Large-Area Diamond Substrates
<p>Researchers investigate how ultrashort laser pulses can be used to slice diamond, with potential applications in optics, semiconductors, and power electronics.</p>
<p>The post <a href="https://www.semiconductor-digest.com/laser-slicing-of-large-area-diamond-substrates/">Laser Slicing of Large-Area Diamond Substrates</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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