Unimicron says Intel's EMIB-T will not reach mass production until 2027, sharpening advanced packaging rivalry

TSMC's CoWoS capacity remains tight, and demand for a second supply route is strengthening, according to Unimicron, which said Intel's EMIB-T advanced packaging platform will not reach true mass production until 2027. The substrate maker said the new platform is already drawing three suppliers, all targeting an initial 50% yield.