ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool

<p>ACM Research, Inc., a supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the shipment of its first 310 × 310 mm Ultra ECP ap-p panel-level horizontal electroplating production system to a customer in Asia outside mainland China.</p> <p>The post <a href="https://www.semiconductor-digest.com/acm-research-announces-shipment-of-its-first-310-x-310-mm-ultra-ecp-ap-p-panel-level-horizontal-electroplating-production-tool/">ACM Research Announces Shipment of Its First 310 × 310 mm Ultra ECP ap-p Panel-Level Horizontal Electroplating Production Tool</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>