TSMC reportedly develops EMIB-like packaging to counter Intel

<p class="P1" data-sourcepos="5:1-5:468;134-601">TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB), signaling that competition in AI semiconductor packaging is becoming as critical as chip manufacturing itself. The project, internally described as "EMIB-like," is being developed with Taiwanese substrate supplier Kinsus Interconnect Technology as TSMC seeks to broaden its packaging portfolio and address growing customer demand.