Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging

<p class="P1" data-sourcepos="5:1-5:316;145-460">Samsung Electro-Mechanics (Semco) is broadening its collaboration with South Korean materials supplier SoulBrain beyond glass substrate etchants to include copper plating chemicals and chemical mechanical polishing (CMP) slurries, as the companies race to secure key materials for next-generation AI chip packaging.