Powertech bets on AMD FOPLP mass production in 2027

Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to enter mass production by mid-2027. The company also said it has teamed with Broadcom in Singapore on FOPLP RDL development and is moving into optical communications, with μ-Bump-based optical engine samples expected to enter small-scale production by year-end.