Samsung reportedly plans 2nm fab to boost HBM base-die output
Samsung Electronics is preparing to build a 2nm- and 4nm-class foundry fab at its Giheung campus in Yongin, South Korea, to expand production of logic base dies used in high-bandwidth memory (HBM). The fab is estimated to cost KRW25 trillion (approx. US$18.6 billion), with the broader project potentially reaching KRW30 trillion if an existing production line is converted into an advanced packaging facility, <em>Seoul Economic Daily</em> reported on November 4.
Read original article ↗
Related Articles
Murata, Samsung Electro-Mechanics reportedly secure Winbond's silicon capacitor capacity
Murata Manufacturing and Samsung Electro-Mechanics (Semco) have reportedly secured silicon capacitor production capacity
Does opting out of TV tracking work?
TVs use automatic content recognition to gather viewing information about us, and opting out doesn’t always stop it. | P
Broadcom loses final appeal over Samsung chip supply deal
South Korea's Supreme Court has upheld a KRW18.664 billion (approx. US$13.9 million) fine against Broadcom for pressurin
SHENZHEN, China, Nov. 4, 2026 /PRNewswire/ -- TCL Technology and Samsung Electronics Co., Ltd. (Samsung Electronics) joi