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Semiconductor Digest November 10, 2026 By Shannon Davis positive

Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&D

SemiconductorsManufacturingData Center
<p>Funds will support next-generation semiconductor research and development in Everett, Washington, enabling substantial power module manufacturing capability in Washington state.</p> <p>The post <a href="https://www.semiconductor-digest.com/helion-signs-letter-of-intent-for-175-million-chips-award-to-advance-u-s-high-voltage-semiconductor-rd/">Helion Signs Letter of Intent For $175 Million CHIPS Award to Advance U.S. High Voltage Semiconductor R&#038;D</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>
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