At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging
<p class="P1" data-sourcepos="3:1-3:396;61-456">When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest, and ASE are sharing the stage with Microsoft, Nvidia, and Google.
Read original article ↗