Digitimes November 12, 2026 By Charlene Chen negative

DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers

AI / LLMSemiconductors

<em>DIGITIMES</em> observes that as AI accelerators continue to grow in size, substrate dimensions are gradually moving beyond 100x100mm. Warpage issues in organic substrates have also become increasingly pronounced, prompting industry players to invest in the development of different core-layer materials. Glass, which offers excellent flatness and an adjustable coefficient of thermal expansion (CTE) that can be brought closer to that of silicon, can help reduce warpage. As a result, it has emerged as a closely watched core-layer solution and a key focus of future technology development.

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DIGITIMES Insight: Entering glass substrate era, core layers are no longer an exclusive process for substrate makers

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