Samsung Electronics breaks ground on new HBM packaging facility in Asan

Samsung Electronics broke ground on a new semiconductor packaging facility at its Onyang campus in Asan, South Chungcheong Province, Thursday as part of a 144 trillion-won ($108.4 billion) investment plan by the company and three affiliates to expand advanced manufacturing capacity in the region. The company held a groundbreaking ceremony at the campus, joined by President Lee Jae Myung, Executive Chairman Lee Jae-yong, Deputy Prime Minister Lee Hyeong-il, South Chungcheong Province Gov. Park Soo-hyun and about 100 executives and employees from Samsung and its partner companies. The new production line, aimed at beginning operations in June 2028, a year ahead of the original schedule, will expand the campus' role beyond conventional semiconductor assembly and testing to include advanced high bandwidth memory (HBM) packaging. "Through today's groundbreaking ceremony, we pledge to take another leap forward," Lee Jae-yong said. "This site, which has traditionally focused on simply assembling and testing conventional semiconductors, will become a leading hub for advanced HBM, the heart of A