Samsung moves up HBM packaging plant opening to June 2028
Samsung Electronics said on November 12 it had moved up the planned opening of its new high-bandwidth memory (HBM) packaging plant in South Korea by one year to June 2028 to meet rising demand for AI server memory.
Read original article ↗
Related Articles
Why Anthropic's blockbuster IPO is getting a muted reception in Korea
Anthropic's planned initial public offering (IPO) is drawing a muted response in Korea despite expectations it could rai
Hoya reportedly unable to meet Samsung's full 2027 EUV mask blank request
Japan's Hoya has reportedly told Samsung Electronics it would struggle to meet the chipmaker's request for additional ex
Samsung's 1TB 990 SSD drops to 19 cents per GB amid the memory crisis — grab it for $40 off
Whether you're building a new PC, expanding your gaming library, or replacing an older SATA drive, Samsung's 990 offers
U.S. tech giant Nvidia Corp. has confirmed its commitment to deploying up to 260,000 graphics processing units (GPUs) in