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HPC Wire November 12, 2026 By Alex Woodie neutral

UCIe Consortium Tackles the Memory Wall with New 4.0 Chiplet Spec

AI / LLMSemiconductorsMemoryManufacturingSupply ChainRegulationData Center
<p>Companies developing chiplet-based computers for HPC and AI applications will see a number of improvements with the new Universal Chiplet Interconnect Express (UCIe) 4.0 specification unveiled today, including a new memory expansion protocol that will deliver more memory bandwidth for demanding HPC and AI applications, as well as up to 80% better energy efficiency, among [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/2026/11/12/ucie-consortium-tackles-the-memory-wall-with-new-4-0-chiplet-spec/">UCIe Consortium Tackles the Memory Wall with New 4.0 Chiplet Spec</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>
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