Chip Industry Technical Paper Roundup: Aug. 4

<p>Hybrid NAND flash-DRAM memory; neuromorphic many-core computing; modular HW-SW leakage verification; bridging p-type gap in oxide electronics w/2D semis; 3D structures from wafer-fabricated precursors; LLM benchmarking for Verilog design flows; pre-silicon power side-channel analysis.</p> <p>The post <a href="https://semiengineering.com/chip-industry-technical-paper-roundup-aug-4/">Chip Industry Technical Paper Roundup: Aug. 4</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>