Hanwha Semitech expands packaging tools as TCB turns profitable

<p class="P1" data-sourcepos="5:1-5:419;112-530">South Korean semiconductor equipment maker Hanwha Semitech is expected to begin recognizing revenue from fan-out panel-level packaging (FOPLP) equipment starting in the third quarter of 2026. The move follows a return to profitability in the second quarter, driven by thermocompression bonding (TCB) tools. FOPLP is set to become the next growth engine as the company broadens its advanced packaging portfolio.