From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era

<em>Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global standards leadership. He also warns that proprietary management interfaces are delaying AI infrastructure deployment and leaving a meaningful share of large GPU fleets in a degraded state.</em>