Samsung previews zHBM stacked-on-logic concept, 400-layer bonded NAND at FMS 2026

Samsung Electronics used the Future of Memory and Storage (FMS) 2026 conference to lay out an AI memory roadmap built around 3D architecture, previewing two concept models — zHBM and zNAND-O — and disclosing a 400-plus-layer NAND built on wafer bonding for the first time.