Thermal Management Strategies for Next-Generation AI Chiplets and Photonic Integrated Circuits

<p>AI accelerator packages that dissipated 300-400W in 2020 routinely exceed 700W today, with roadmaps pointing past 1,000W — while the photonic ICs increasingly co-packaged alongside them need temperature stability measured in tenths of a degree.</p> <p>The post <a href="https://www.semiconductor-digest.com/thermal-management-strategies-for-next-generation-ai-chiplets-and-photonic-integrated-circuits/">Thermal Management Strategies for Next-Generation AI Chiplets and Photonic Integrated Circuits</a> appeared first on <a href="https://www.semiconductor-digest.com">Semiconductor Digest</a>.</p>