Samsung Attacks the AI Memory Wall with 3D Packaging

<p>The AI memory wall has emerged as the biggest bottleneck in executing AI inference workloads. This week at the Future of Memory and Storage Summit, Samsung threw the kitchen sink at the problem, unveiling not only a new type of high-bandwidth memory called zHBM but two new NAND offerings for solid state disks (SSDs), including [&#8230;]</p> <p>The post <a href="https://www.hpcwire.com/2026/08/06/samsung-attacks-the-ai-memory-wall-with-3d-packaging/">Samsung Attacks the AI Memory Wall with 3D Packaging</a> appeared first on <a href="https://www.hpcwire.com">HPCwire</a>.</p>