Panel makers turn old fabs into AI-advanced packaging hubs

<p class="P1" data-sourcepos="5:1-5:501;107-607">AI-driven demand for advanced packaging is giving old-generation panel fabs and equipment new value. As Taiwan's panel makers accelerate the phaseout of LCD capacity at the 5.5 generation and below, they are splitting into two tracks: selling factories to foundries and outsourced semiconductor assembly and test (OSAT) providers, or keeping lines in-house to develop fan-out panel-level packaging (FOPLP), through-glass via (TGV), redistribution layer (RDL), and glass core technologies.