Exclusive: STATS ChipPAC readies broad packaging price hikes on AI-driven OSAT squeeze

<p class="P1" data-sourcepos="5:1-5:303;136-438">AI chip demand is sustaining a global rise in semiconductor packaging and testing prices, with STATS ChipPAC preparing a broad round of price increases for the second half of 2026. Some customers have recently received notices of varying adjustments from the Singapore-based subsidiary of China's JCET.