Model Tracks Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates (imec)

<p>An imec researcher published a technical paper titled “Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates.” Abstract: &#8220;Bonding and assembly processes have started to take the centre-stage in semiconductor manufacturing as they enable three-dimensional (3D) stacking and heterogeneous integration for novel interconnect architectures of integrated circuits. The progression of a bond front hinges on... <a class="read_more" href="https://semiengineering.com/model-tracks-bond-front-velocity-for-wafer-and-die-bonding-imec/">&#187; read more</a></p> <p>The post <a href="https://semiengineering.com/model-tracks-bond-front-velocity-for-wafer-and-die-bonding-imec/">Model Tracks Bond Front Velocity in Lubrication-Mediated Bonding of Flexible Substrates (imec)</a> appeared first on <a href="https://semiengineering.com">Semiconductor Engineering</a>.</p>